PVD Thin Film Coating Materials

Physical Vapour Deposition (PVD) Sputtering is a physical process where a target material used as the coating is bombarded with positively charged ionized gas molecules (typically Argon) in an inert gas chamber causing atoms to be “Sputtered” off into the plasma. These vaporised atoms are then deposited when they condense as a thin film on the substrate or wafer to be coated. This is also known as PVD Thin Film Coating.

PVD is specifically used in the manufacture of materials which require thin films for Mechanical, Optical, Chemical or Electronic functions. Electrical Conductivity, Hardness, Wear and Corrosion / Oxidation Resistance of a substrate will be significantly enhanced, improving its performance efficiency in areas of applications such as:

  • Decorative
  • Architectural
  • Optoelectronics
  • Semiconductor
  • Data Storage
  • Photovoltaics
  • Tribology

PVD Sputtering Targets and Backing Plates are provided and available in a varied range of physical mechanical designs depending on customer specific PVD processes employed. Compositions and Purities of the Sputtering Targets are allowed for customisation to fulfil specific customer requirements.

Pvd thin film coatings

PVD Target Processing Methods

  • Machined Bar Stocks
  • Vacuum Hot Pressing and Vacuum Sintering
  • Cold / Hot Isostatic Pressing (CIP / HIP)
  • Vacuum Induction Melting
  • Melting and Casting
  • Forging and Rolling
  • C-Scan Ultrasonic Imagery
  • Customized Backing Plates Machining from Bar Stocks
    • Oxygen-Free High Conductivity Copper (OFHC)
    • Molybdenum (Mo)

PVD Target Materials Design and Assembly Methods

  • Planar Targets – Single Tile and Multiple Tiles
  • Cylindrical Targets – Single Tile and Multiple Tiles
  • Target Bonding Techniques
    • Indium Metal Bonded Assembly – Target and Backing Plate
    • Elastomer Bonded Assembly – Target and Backing Plate
    • Nanofoil Bonded Assembly ~ Target and Backing Plate

Materials used for fabricating Sputtering Targets possess purities ranging from 99.5% – 99.999%:

  • Pure Metals and Non-Metals (Ceramics)
  • Carbides, Oxides, Borides and Nitrides
  • Dual and Multiple Alloys


Typical PVD Sputtering Materials and Purities
Purity %
Purity %
Purity %
Aluminium CopperAlCu99.999Silicon NitrideSi3N499.9Indium Tin OxideITO99.99
Aluminium NitrideAlN99.0Silicon DioxideSiO299.995IridiumIr99.9
Aluminium OxideAl2O399.99TantalumTa99.95Lanthanum TrifluorideLaF399.9
Aluminium SiliconAlSi99.999Tantalum CarbideTaC99.5ManganeseMg99.9
GoldAu99.99TerbiumTb99.9Magnesium OxideMgO99.9
Barium OxideBaO99.9TitaniumTi99.995ManganeseMn99.95
Boron NitrideBN99.99Titanium CarbideTiC99.5Manganese PlatinumMnPt99.9
CarbonC99.999Titanium DioxideTiO299.9MolybdenumMo99.98
Calcium FluorideCaF299.95Titanium NitrideTiN99.5 Molybdenum DisulfideMoS299.0
Copper NickelCoNi99.9TungstenW99.9NickelNi99.999
ChromiumCr99.98YttriumY99.9Nickel ChromiumNiCr99.95
CopperCu99.999ZincZ99.99Nickel IronNiFe99.95
ErbiumEr99.9Zinc SulphideZnS99.9Nickel VanadiumNiV99.95
IronFe99.95Zinc SelenideZnSe99.99OsmiumOs99.9
Iron ManganeseFeMn99.9Zinc OxideZnO99.99LeadPb

GermaniumGe99.999Zinc Oxide AluminiumZnOAl99.90PalladiumPd99.9
Germanium DioxideGeO299.999ZirconiumZr99.7PlatinumPt99.99