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Microelectronics Packages
Microelectronic Packages, also referred to as Hermetic Microelectronic Packages or Integrated Circuit (IC) Packages completes electrical assemblies by packaging sensitive electronic components in a Hermetically Sealed Microelectronic Housing.
Thereby, gaining properties like High Temperature, Shock and Vibration Resistance, protecting it from harsh environmental conditions. At the same time, the vacuum-tight housings and substrates must enable power and signal transmission in both electrical and optical means into/out of the package.
We provide Microelectronic Metal & Ceramic Packages for a variety of applications.
Application Areas include:
- Electronics
- Telecommunication
- Automotive
- Aerospace / Aviation
Manufacturing Specifications are compliant to:
- Commercial Standards
Typical Package Materials used:
- Ceramics
- Aluminium Oxide (Al2O3)
- Metals
- Metal 4J29 – Kovar (FeNiCo Alloy)
- Metal 4J42 / 4J50 – Nickel Iron (FeNi Alloy)
- Oxygen-Free High Conductivity Copper (OFHC)
Package Surface Finish – Base and Lead Pins
- Nickel (Ni) Plating
- Gold (Au) Plating
- Nickel (Ni) & Gold (Au) Plating
Typical Metal Packages and their Properties / Specifications
Base, Cover and Lead Pins
Base and Cover Material Specifications | |||
Material | Density | Temperature | Coefficient of |
| Kovar 4J29 | 8.2 g/cm3 | 17 %/°C | 5.8 10-6/°C |
| Cold-Rolled Steel | 7.8 g/cm3 | 50 – 76 %/°C | 12 – 14 10-6/°C |
| Copper OFHC | 8.9 g/cm3 | 398 %/°C | 17.8 10-6/°C |
Lead Pins Material Specifications | ||
Material | Dimensions | Current |
| Kovar 4J29 | Ø0.45 mm | 1 A |
| Ø0.76 mm | 3.2 A | |
| Ø1.00 mm | 5 A | |
| Ø1.50 mm | 10 A | |
| Fe-Ni Alloy 4J42 / 4J50 | Ø0.45 mm | 1 A |
| Ø0.76 mm | 3.5 A | |
| Ø1.00 mm | 5.5 A | |
| Ø1.50 mm | 11 A | |
| Fe-Ni Alloy 4J42 / 4J50 Copper-Cored | Ø0.76 mm | 4.3 A |
| Ø1.00 mm | 7.5 A | |
| Ø1.50 mm | 16.8 A | |
| Pure Copper Lead Pins can be used under heavy current conditions | ||
Hybrid Integrated Circuit Packages
Meets the requirements of High Reliability Wave Filters, Power Amplifiers, Pulse Width Modulators, Angle Converters, Pressure Sensors and Surface Acoustic Wave Components, Relays. Applicable for use in Automotive Electronics and Medical.
Hybrid Integrated Circuit Packages | |
| Current | 100 A MAX |
| Voltage | DC 3000 V MAX |
| Pin Pitch | 1.27 mm MIN |
| Hermeticity | ≤ 1 x 10-3Pa.cm3/s (He) |
| Insulation Resistance | ≥ 1 x 1010 Ω (500 V DC) |
| Salt Spray Proof | 24 hrs (48 hrs Partial) |
Fibre Optic Packages
Meets the requirements of Optical Transmitters, Optical Receivers, Wave-Lockers, Modulators, Attenuators, Wave-Length Selective Switches, Optical Detectors, Pump Laser and High-Power Lasers. Applicable for use in Optical Communications, Automotive Electronics and Medical Electronics.
Fibre Optic Packages | |
| Working Frequency | DC ~ 40 GHz |
| Wavelength | 800 – 1650 nm |
| Transmissivity | ≥ 99% (Double-edged Film) |
| Characteristics | Meet the transmission requirements of Infrared Visible and Ultraviolet Light |
| Hermeticity | ≤ 1 x 10-3Pa.cm3/s (He) |
| Insulation Resistance | ≥ 1 x 1010 Ω (500 V DC) |
Infrared Detector Packages
Satisfies the requirements of first and second generation Refrigerating and Non-Refrigerating Infrared Detectors. Applicable for in the manufacture of Fire-Control Electronics and Automotive Electronics.
Infrared Detector Packages | |
| Pin Pitch | 0.5 mm MIN |
| External Pin Connection | Direct plug-in mounting or surface mounting with connectors |
| Hermeticity | ≤ 1 x 10-3Pa.cm3/s (He) |
| Insulation Resistance | ≥ 1 x 1010 Ω (500 V DC) |
Microwave Component Packages
Meets the requirements of Microwave Power Modules and also applicable for use in Aviation, Aerospace Electronics and Watercraft.
Microwave Component Packages | |
| Working Frequency | DC ~ 40 GHz |
| Hermeticity | ≤ 1 x 10-3Pa.cm3/s (He) |
| Insulation Resistance | ≥ 1 x 1010 Ω (500 V DC) |
| Salt Spray Proof | 24 hrs (48 hrs Partial) |
Surface Acoustic Wave Component Packages
Critical Signal Processing Circuit Component used in Communication System Electronics.
Surface Acoustic Wave Component Packages | |
| Working Frequency | DC ~ 40 GHz |
| Hermeticity | ≤ 1 x 10-3Pa.cm3/s (He) |
| Insulation Resistance | ≥ 1 x 1010 Ω (500 V DC) |
| Salt Spray Proof | 24 hrs (48 hrs Partial) |
Transistor Outline (TO) Packages
Meets the requirements of Laser, Detectors and Sensors. Applicable for use in Optical Communications, Automotive Electronics and Medical Electronics.
Transistor Outline (TO) Packages | |
| Working Frequency | DC 10 GHz MAX |
| Hermeticity | ≤ 1 x 10-3Pa.cm3/s (He) |
| Resistance | 50 Ω MAX |
| Coating | 0.1 µm MIN |
Plug-in Platform Metal Package for Hybrid Integrated Circuit
Application Areas: Hybrid Thick Film and Thin Film Integrated Circuits Package
(Suitable for Plug-In-Assembly)
Material: 4J29 (Fe / Ni / Co Alloy).
Surface Finish: Ni / Au Plating, Au Plating
Technical Specifications: GAB 244 (General Standard for Hybrid Integrated Circuit Package)
Plug-in Sidewall Metal Package for Hybrid Integrated Circuit
Application Areas: Hybrid Thick Film and Thin Film Integrated Circuits Package
(Suitable for Plug-In-Assembly)
Material: 4J29 (Fe / Ni / Co Alloy).
Surface Finish: Ni / Au Plating, Au Plating
Technical Specifications: GJB 244 (General Standard for Hybrid Integrated Circuit Package)
Can-Flat Form Metal Package
Application Areas: Hybrid Thick Film and Thin Film Integrated Circuits Package
(Suitable for Plug-In-Assembly)
Material: 4J29 (Fe / Ni / Co Alloy)
Surface Finish: Ni / Au Plating, Au Plating
Technical Specifications: GJB 244 (General Standard for Hybrid Integrated Circuit Package)
Circular Metal Package for Hybrid Integrated Circuit
Application Areas: Hybrid Thick Film and Thin Film Integrated Circuits Package
(Suitable for Plug-In-Assembly)
Material: 4J29 (Fe / Ni / Co Alloy)
Surface Finish: Ni / Au Plating, Au Plating
Technical Specifications: GJB 244 (General Standard for Hybrid Integrated Circuit Package)
High-Power Device Headers
Application Areas: Hybrid Thick Film and Thin Film Integrated Circuits Package
(Suitable for Plug-In-Assembly)
Material: 4J29 (Fe / Ni / Co Alloy)
Surface Finish: Ni / Au Plating, Au Plating
Technical Specifications: GJB 244 (General Standard for Hybrid Integrated Circuit Package)
Fibre Optic Package
Application Areas: Photo-detector and Photo-amplifier
Material: 4J29 Alloy or Tungsten Copper Alloy
Surface Finish: Ni / Au Plating
Technical Specifications: GJB 244 (General Standard for Hybrid Integrated Circuit Package)
Transistor Outline Header
Application Areas: Photo-detector and Photo-amplifier
Material: 4J29 Alloy or Tungsten Copper Alloy
Surface Finish: Ni / Au Plating
Technical Specifications: GJB 244 (General Standard for Hybrid Integrated Circuit Package)
Typical Ceramic Packages and their Properties / Specifications
Double-In-Line Plug-In (DIP) Ceramic Package
- Semiconductor Integrated Circuit Seal-Package.
- Standard Pitch between Lead Pins is 2.54 mm.
- Maximum Lead Pins available up to 64.
Double-in-Line (DIP) Ceramic Package | ||
Type | Overall Length x Width | Mounting Pin Distance |
| 08S2-01 | 10.16 x 7.87 mm | 7.62 mm |
| 14S2-01 | 17.78 x 7.87 mm | 7.62 mm |
| 14S2-02 | 17.78 x 7.87 mm | 7.62 mm |
| 16S2-02 | 20.32 x 7.87 mm | 7.62 mm |
| 16S2-03 | 22.86 x 7.87 mm | 7.62 mm |
| 18M2-04 | 22.86 x 10.41 mm | 7.62 mm |
| 18M2-04 | 22.86 x 10.41 mm | 10.16 mm |
| 20S2-02 | 25.40 x 7.87 mm | 7.62 mm |
| 22M2-01 | 27.94 x 10.41 mm | 10.16 mm |
| 24S2-03 | 30.48 x 7.87 mm | 7.62 mm |
| 24L2-01 | 33.48 x 15.49 mm | 15.24 mm |
| 28L2-01 | 35.56 x 15.49 mm | 15.24 mm |
| 28L2-02 | 35.56 x 15.49 mm | 15.24 mm |
| 25L2-03 | 35.56 x 15.49 mm | 15.24 mm |
| 28L2-04 | 35.56 x 15.49 mm | 15.24 mm |
| 40L2-01 | 50.80 x 15.49 mm | 15.24 mm |
| 40L2-02 | 50.80 x 15.49 mm | 15.24 mm |
| 48L2-01 | 50.96 x 15.49 mm | 15.24 mm |
| 64L2-01 | 81.28 x 23.11 mm | 22.86 mm |
Ceramic Flat Package – Surface Flat Package (FCP) / Quad Flat Package (QFP)
Ceramic Flat Package suitable for surface fix, small volume, light weight, high package density. Lead – Pitch for CFP / CQFP Lead Wires is 1.27 mm and 1.27 / 1.00 / 0.63 mm respectively.
Ceramic Flat (FCP / QFP) Package | |
Type | Overall Length x Width |
| 03-01 | 4.5 x 6.0 mm |
| 03-02 | 9.6 x 7.0 mm |
| 03-04 | 3.5 x 7.8 mm |
| 04-01 | 6.5 x 7.0 mm |
| 04-02 | 4.5 x 5.0 mm |
| 24-01 | 10.16 x 10.16 mm |
Ceramic Pin Grid Array (CPGA) Ceramic Package
CPGA for VLSI applications, features High Package Density, Good Electric Thermal Property, Good Airtightness, High Reliability. Lead Pin Pitch is 2.54 mm. Cavities can be configured i.e. Positive or Negative.
Ceramic Pin Grid Array (CPGA) Package | |
Type | Overall Length x Width |
| 84-01 | 27.94 x 27.94 mm |
| 68-01 | 27.94 x 27.94 mm |
| 64-01 | 25.4 x 25.4 mm |
| 68-02 | 27.94 x 27.94 mm |
| 121-01 | 33.5 x 33.5 mm |
| 132-01 | 36.8 x 36.8 mm |
| 168-01 | 44.45 x 44.45 mm |
Leadless Ceramic Chip Carrier (LCCC) Ceramic Package
- LCCC packages for high density surface
- Characteristics of small volume, light weight, good thermal quality, high reliability
- Lead Pin pitches are 1.27 / 1.0 / 0.635 mm
Leadless Ceramic Chip Carrier (LCCC) Ceramic Package | |
Type | Overall Length x Width |
| 4D3-01 | 5.6 x 3.8 mm |
| 6D3-01 | 6.2 x 4.3 mm |
| 10D3-01 | 13.3 x 6.5 mm |
| 20D32-01 | 13.21 x 10.16 mm |
| 28D2-01 | 18.29 x 10.16 mm |
| 32D2-01 | 20.83 x 10.16 mm |
| 12F3-01 | 13.3 x 6.5 mm |
| 18F3-01 | 8.89 x 7.24 mm |
| 28F3-01 | 13.97 x 8.89 mm |
| 32F3-01 | 13.97 x 11.43 mm |
| 24-01 | 8.5 x 8.5 mm |
| 64-01 | 18.3 x 18.3 mm |
| 84-01 | 29.2 x 29.2 mm |