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Welcome to XT Xing Technologies
Delivering Excellence
Engineering Materials For Manufacturing Applications
Metal Packages
Plug-In Platform Package
Plug-In-Sidewall Package
Can-Flatform Package
Circular Metal Package
High Power Device Header Package
Fibre Optic Package
Transistor Outline Header Package
Mounting Rabbet Package
Ceramic Packages
Ceramic Dual-In-Line Package
Ceramic Flat Package
Ceramic Pin Grid Array Package
Ceramic Quad Flat Package
Ceramic Leadless Chip Carrier Package
Ceramic Quad Flat Non-Leaked Package
Ceramic Small Outline Package
Ceramic Land Grid Array Package
Surface Mount Device Package
Typical Materials
Kovar
Invar
Tungsten Copper
Molybdenum Copper
Aluminium Oxide
Aluminium Nitride
Oxygen Free High Copper
Gold Electrolytic Coated
Nickel Electrolytic Coated
Gold-Tin Alloy
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