Engineering Ceramics

Engineering Ceramics are structured ceramics whose physical properties are optimized for industrial applications in various stages of manufacturing such as Shaping, Sintering and Finishing. Engineering Ceramics typically have good temperature resistance capabilities greater than 2000 °C and other inherent characteristics such as minimal wear rates, non-corrosiveness and being electrically insulative.

The general properties of ceramic materials present the following advantages:

  • Controlled Microstructures / High Purities
  • High Uniformity with High Tolerances Control / Machined
  • Polished / Near Net Shape Processing
  • Low Particles Generation
  • Excellent Wear / Abrasion Resistance
  • Excellent Dielectric Properties
  • Chemically (Acidic & Alkaline) Inert
  • Good Thermal Conductivity
  • Excellent Size and Shape Capability
  • High Strength and Stiffness
  • Excellent Fracture Toughness
  • Excellent Impact Resistance

With such properties, Engineering Ceramics are best suited to be used in the following areas of applications:

  • Dielectric Strength
  • Electrical Isolation
  • High Temperature Exposure
  • Corrosive Environment
  • Chemicals and Gases
  • Thermal Shock
  • Liquid and Gas Permeable / Impermeable
  • Thermal Expansion Match
  • Electro-Statics Dissipation
  • Thin Film Deposition

We offer Engineering Ceramics with Purities ranging from 86.00% to 99.99%. To satisfy our customers’ requirements, purity and composition of ceramics are manufactured as required and delivered according to their specifications.

Product Forms

  • Sputtering Targets
  • Wafers Processing Tools
  • Semiconductors Processing Tools
  • Electronics / Mechanical Processing Tools

Typical Engineering Ceramics

  • Aluminium Oxide (Al2O3)
  • Zirconia Oxide (ZrO2)
  • Zirconia Toughened Aluminium Oxide (ZTA)
  • Silicon Nitride (Si3N4)
  • Silicon Carbide (SiC)
  • Boron Nitride (BN, PBN)
  • Aluminium Nitride (AlN)
  • Machinable Ceramics (MACER)
  • ESD Zirconia (ZrO2) – Specifications will be provided upon request
  • ESD Alumina (Al2O3) – Specifications will be provided upon request
  • Porous Alumina (Al2O3)

ESD Ceramics are Electrostatic Dissipative materials that dissipate charges to ground in a slower and more controlled manner than with conductive materials. ESD Ceramics are used for the manufacture of precision automation and production tools, fixtures and product components where static charges and particle contamination must not be present.

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Typical Engineering Ceramics Grades and Specifications

Engineering Ceramics Grades
Unit
Al2O3
> 95-97%
Al2O3
> 99.7%
Zr2O2
ZrO2+
Y-PSZ
Zr2O2
ZrO2+
Mg-PSZ
Zr2O2
3Y-TZP
ZTA
Al2O3+ ZrO2
Si3N4
SiC
BN
AlN
MACER
ColourWhite / IvoryWhite / IvoryWhiteYellowWhiteWhiteGrey / BlackGreyWhiteGreyWhite
Densityg/cm33.73.965.764.13.23.11.95-2.003.32.58
Flexural StrengthMPa3003908007001,10060075041030420108
Compressive StrengthMPa3,4003,9003,0002,5002,5003,6002,5002,60058NA488
Young’s Modulus of ElasticityGPa350390205200200350320410NA32065
Impact ResistanceMPa.m1/24.05.587117.56.73.2NANANA
Weibull ModulusM10121518NA151510NANANA
Vickers HardnessHV 0.51,8002,0001,1501,2002,2001,6001,6502,500NA8 Moh’s4 – 5 Moh’s
Thermal Expansion Coefficient10-6 K-15.0 – 8.35.5 – 8.5101010.56.0 – 8.63.44.0 – 5.81.54.4 – 4.88.6
Thermal ConductivityW/m.K2430< 2< 2NA1822110301801.68
Thermal Shock ResistanceΔT°C250280270250300320750350NANANA
Maximum Use Temperature°C1,6001,7001,0001,0001,0001,0001,3001,500900 – 2,100NA750
Volume Resistivity @ 20 °CΩ·cm>1014>1015>1010>1010>1012>1013>1011NA>1014>1014>1014
Dielectric StrengthkV/mm2030NANANANA20NANA1740
Dielectric Constantεr1010NANANANANANANA8.9NA
Dielectric Loss Angle @ 20°C, 1MHztanδ0.00010.0005NANANANANANANA2.8 x 10-4NA
Typical Engineering Ceramics Porous Grades and Specifications
Properties
Unit
Porous Al2O3
Al2O3WT %82 – 84
SiO2WT %16 – 18
Densityg/cm32.3 – 2.5
HardnessHRA50
Flexural StrengthMPa40
Compressive StrengthMPa600
Porosity%40
Pore Sizeµm30 – 60
Operating PressureMPa10
Acid Resistancemg/cm210
Alkali Resistancemg/cm220

Micro-Precision Manufacturing Process Capabilities

Given its ability to withstand high heat under applications, industries such as Telecommunication, Hard Disk Drives, Semiconducting Manufacturing and Electro-Mechanical Parts & Assemblies require ceramic parts to be Micro-Precision Manufactured.

We offer a wide array of Precision Machining capabilities such as Grooving, Slicing, Grinding, Lapping & Polishing.

Slicing Process Capabilities:

  • Multiple Wire Saw Machines (Free Abrasives Machining)
  • Wire Diameter 0.07 – 0.20 mm
  • Work Size Typical 80 x 85 x 90 mm
  • Slicing Thickness 0.10 – 1.00 mm
  • Materials include Ceramics, Ferrous and Non-Ferrous
  • Thickness Tolerances +/- 0.015 mm

Grooving, Slicing, Grinding, Lapping & Polishing

  • Work Sizes 150 x 150 mm
  • Work Piece Thicknesses 0.30 – 4.00 mm
  • Final Part Sizes 0.500 x 0.500 mm
  • Diamond Blade Thickness of 0.10 – 1.00 mm
  • Standard Working Tolerances of ± 0.10 mm
  • Lapping to Thickness 0.070 mm with tolerance of ± 0.002 mm
  • Typical abrasives GC (Green Silicon Carbide) / WA (White Alumina)
  • Surface Finish: 0.2 – 0.6 µm Lapped / < 0.0254 µm Polished