Silicon Wafers

Polishing Capacity 4000 wafers per 24 hours
> Prime, Test and Reclaim (Cost Saving) Grades
> Cz and Fz Monocrystal Types
> Epitaxial Wafers with Epitaxial Layer Thickness of 0.1~ 100 microns
> Silicon-0n-Insulator Wafers with Device Layer Thickness of 3 ~ 100 microns
> Quality meeting or exceeding SEMI Standards

Dopants
> N-Type – Phosphorous, Antimony or Arsenic
> P-Type – Boron

Orientation
<1-0-0>, <1-1-1> or <1-1-0>

Diameters
> 50 mm, 76 mm, 100 mm, 125 mm, 150 mm, 200 mm and 300 mm
> 2 ins, 3 ins, 4 ins, 5 ins, 6 ins, 8 ins and 12 ins

Customised Services
> Laser Manufacturing Services
> Custom Sizing (Dicing) / Custom Flats

Edge Profile Capabilities
> Silicon, Ceramics and Silicon Carbide

Lapping Capabilities
> Single and Double Sided Processing

Coatings
> Metals and Oxides
> Coating Thicknesses 500 ~ 30,000 Armstrong +/- 2 ~ 10%
> Specialised Coatings of Thickness 15 microns

Other Semiconductor Materials
> Germanium, Silicon Germanium, III-V Compounds, Specialty Substrates, Laser
   Materials, Piezoelectric Materials, Glass and Quartz Materials

Wafer Handling Accessories

Wafer Cassettes With or Without Handles
> Metallic Wafer Handling Cassettes / Metallic Wafer Bake-out Cassettes
> Wafer handling size capabilities – 4ins, 5ins, 6ins, 8ins and 12ins
> Wafer bake-out size capabilities – 8ins and 12ins
> Storage Slots – 12, 25, 50 typical per customer specifications
> Cassettes can be supplied with or without Handling Bars
> Customized Cassettes with varied Slot Widths, Spacings, Handles and Lengths
> Wafer Cassettes manufactured using Corrosion Resisting Stainless Steel Grade 316

Application Areas – Semiconductors manufacturing processes
> Robotics or Push Transfer Loadings
> Light Baking Processes

Application Benefits
> Higher Durability - Lower Costs (Less Wear and Tear)
> Minimized Out-Gassing
> Minimized Particles
> Light Weight
> Better Conductivity - Uniform Heat Distribution
> High Thermal Exposure conditions upto 400 Degs C