Electronics Packaging

Application Areas
> Electronics / Telecommunication / Aerospace

Specification Standard
> Commercial / China Military Standards

Typical Package Materials
> Ceramics Al2O3 (Aluminium Oxide)
> Metals 4J29 (Kovar - FeNiCo Alloy)
> Metals 4J42 (FeNi Alloy)

Package Surface Finishing
> Nickel Ni Plating
> Nickel Ni and Gold Au Plating

Typical Package Types

Ceramic Packages
> DIP ~ Side Brazing Dual in Line Package / CPGA ~ Ceramic Pin Grid Array Package
> CFP / CQFP ~ Ceramic Flat Package / Ceramic Quad Flat Package
> LCCC ~ Leadless Ceramic Chip Carriers
> SMD ~ Crystal Oscillator Saw Ceramic Package (Surface Mount Devices)
> LTGP ~ Low Temperature Glass Package

Metal Packages
> PIPP ~ Plug-In Platform Package / PISP ~ Plug-In-Sidewall Package
> CFP ~ Can Flat-form Package / CMP ~ Circular Metal Package
> FOP ~ Fibre Optic Package
> SH ~ Sensor Headers
> HPDH ~ High-Power Device Headers